Advantest Corporation has introduced the RND440 Type 3 fixture, an optional enhancement on its T6391 display driver IC (DDI) tester. The unit makes the system capable of massively parallel testing of chip-on-film (CoF) packages for the latest generation of smart phone screens.
The unit is designed to handle the growing number of pins on DDIs, the increasing speeds of interfaces and the highly integrated functions that enable high-resolution displays.
The new RND440 Type 3 fixture can perform both high-pin-count, high-speed wafer testing and CoF testing, also called tape testing. It can test all of the electrical components within a CoF package, which include an IC mounted on a base film, several passive elements and signal-input circuitry for receiving and transmitting data.
The fixture works with substrates as large as 440 mm and its massively parallel testing capability doubles the throughput of single-device systems on the market.
The RND440 Type 3 fixture has already begun shipping to customers earlier this calendar year.