electronica 2014 – EDAC

Pubblicato il 3 novembre 2014

At this year’s electronica EDAC (Hall B4, Stand 255 – 259) responds to industry demands for customisation of interconnect products.

The company will showcase it’s cardEDGE+ connectors to visitors, available in a multitude of variations, offering designers the flexibility to meet the industry drive to add differentiating features in space constrained power supplies, storage devices, navigational equipment, industrial controls and medical equipment.
cardEDGE+ connectors are available in 8,000 standard styles and 435,000 custom variations.

There is a choice of contact spacing from 1.27 through to 5.08 and with 2 to 188 contacts in single, bridged and dual rows, with or without card guides. Operating temperatures range from -65oC to 105 oC.  Also possible is an insertion force of 16oz (4.45N) which ensures high contact reliability and connection retention with contact resistance as low as 10mΩ.

Other options are extra row spacing, multiple PCB footprints, polarising options, extra mountings, additional high temperature insulators, insulator dimensions, multiple insulator colours and extra contact plating to meet customer-specific design requirements for interconnect products. Specialised contact options are available and include PCB through-hole, wirewrap, solder eyelet, extender board tail.

Selecting from the proven cardEDGE+ and cardEDGE+ Press Fit range of competitively priced connectors allows the designer to include more options in an interconnect model that is tailored for specific interconnect requirements.

pb



Contenuti correlati

  • Consorzio AMP, primo insieme di standard per sistemi di potenza distribuiti

    Il consorzio AMP (Architects of Modern Power) ha annunciato l’introduzione dei primi standard il cui obbiettivo è definire specifiche meccaniche ed elettriche comuni per lo sviluppo di tecnologie avanzate di conversione della potenza, da utilizzare in sistemi...

  • electronica 2014 preview – Knowles Capacitors

    La nuova serie PSL di MLCC (condensatori ceramici multistrato), realizzata da Syfer, divisione di Knowles Capacitors (electronica 2014 – Stand B6, Stand 336, Padiglione A5, Stand 516), con l’esclusivo processo Screen Printing, è adatta all’impiego in alimentatori,...

  • electronica 2014 preview – Micrel

    Micrel in occasione di electronica 2014 (Padiglione A5, Stand 531) presenta in anteprima una linea completa di circuiti integrati destinati ai mercati in espansione in Europa, quali quello industriale e automobilistico. Lighting Micrel presenterà il campione di un faro...

  • electronica 2014 – Kemet

    KEMET in occasione di electronica (Padiglione B6, Stand 442) lancia le nuove serie di condensatori al tantalio e presenta i condensatori ceramici avanzati di elevate prestazioni. Questi nuovi prodotti andranno a rafforzare ulteriormente la posizione dell’azienda sul...

  • electronica 2014 – Spansion

    Spansion announced a new series of intelligent LED driver integrated circuits (IC) solutions. Integrating the necessary components for intelligent lighting into a single chip solution, the S6AL211 series is designed to reduce development costs and speed time...

  • electronica 2014 – Maxim Integrated

    In occasione di electronica 2014 Maxim Integrated Products espone numerose soluzioni nuove e innovative rivolte ai mercati industriale e medicale. Migliore precisione della misura di flusso per le utility Dotato di un’autonomia che può raggiungere vent’anni con una...

  • electronica 2014 – congatec

    congatec will present at electronica 2014 (Hall A6, Stand 306) an industrial Mini-ITX motherboard based on the new Intel Atom E3800 series (codenamed Bay Trail). The conga-IA3 is an extremely low-power, high-performance single board computer (SBC) with...

  • electronica 2014 – Intersil

    Intersil will showcase its technology innovations at electronica. Several highly differentiated Intersil products, including bridge drivers, radiation hardened ICs, and analog and sensor ICs will be demonstrated at three distribution partner booths. Intersil demonstrations: Macnica’s Booth 167...

  • electronica 2014 – FCI

    FCI will be exhibiting and launching new products at the electronica 2014 (Hall B3, Stand 161). FCI will feature at its booth product highlights from various product categories, namely Board to Board and Wire to Board, Power...

  • electronica 2014 – congatec

    congatec (electronica 2014 – Hall A6, Stand 306) is expanding its successful product range with its first industrial Thin Mini-ITX motherboard. The conga-IC87 is based on 4th generation Intel Core single-chip processors (codenamed Haswell) and features a...

Scopri le novità scelte per te x