Components-en
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GaN performance in NXP’s multi-chip modules for 5G infrastructure
NXP Semiconductors announced the integration of Gallium Nitride (GaN) technology to its multi-chip module...
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New Lattice CertusPro-NX general purpose FPGAs
Lattice Semiconductor launched the Lattice CertusPro-NX general purpose FPGA family. As the fourth device...
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Convection cooled 350W medical power supplies from TDK-Lambda
TDK Corporation announces the introduction of the TDK-Lambda CUS350MP series of AC-DC power supplies...
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Silanna Semiconductor extends CO2 Smart Power DC/DC product family
Silanna Semiconductor has extended its CO2 Smart Power family of wide-voltage, high-frequency point of...
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Toshiba expands scope of its solid-state LiDAR solution
Toshiba Corporation has announced an updated version of its solid-state LiDAR solution. This new...
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Accelleran’s 5G dRAX cloud-native OpenRAN software now available
Accelleran announces the availability of 5G Standalone dRAX cloud-native OpenRAN software components. dRAX implements...
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1200 V power modules of the Infineon CIPOS Maxi SiC IPM IM828 series at Rutronik.
CIPOS Maxi SiC IPM is a 55 mΩ three-phase CoolSiC MOSFET-based open emitter intelligent...
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Centimeter-level GPS technology for precise positioning
u-blox has released a firmware update for its ZED-F9R positioning module, bringing robust centimeter-level...
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Teledyne e2v : fully space-qualified 4-channel ADC
Teledyne e2v’s EV12AQ600 has just been confirmed as the industry’s first 4-channel analog-to-digital converter...
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Infineon presents a fully programmable three-phase driver IC
To enable the next generation of innovative and high-performance battery-powered products, Infineon Technologies expands...
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Automotive-compliant LED driver from Diodes Incorporated
Diodes Incorporated has expanded its portfolio of devices supporting automotive exterior illumination with the...
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Infineon launches new OptiMOS packages in TOLx family
Infineon Technologies offers more choices to power system designers to meet diverse design needs...
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ARIES Embedded expands SoM product range
ARIES Embedded has started volume production of the M100PFS System-on-Module (SoM). The platform is...
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Allegro’s new 3DMAG magnetic position sensor
Allegro MicroSystems announced the release of the A31315 sensor, the newest member of the...
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GPIO Expanders from Diodes Incorporated
Diodes Incorporated has announced 16-bit PI4IOE5V6416Q and 34-bit PI4IOE5V6534Q bidirectional voltage-level translation general-purpose I/O...
News/Analysis Tutti ▶
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Massimo Valerii è il nuovo presidente di Anie CSI
Anie CSI ha nominato presidente Massimo Valerii per il bienio 2026-2028. Anie CSI è l’associazione...
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Infineon e Siemens collaborano per proteggere i data center
Infineon e Siemens stanno collaborando per migliorare la protezione elettrica nei data center, impianti di...
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Cosmic Semiconductor Solutions a Pcim Europe 2026
Cosmic parteciperà per la prima volta a Pcim Europe 2026, evento che si terrà a...
Products Tutti ▶
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Murata: nuovi convertitori DC-DC ad alto isolamento
Murata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...
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TDK-Lambda introduce nuovi alimentatori per DIN rail
La gamma di prodotti TDK-Lambda della serie D1SE è stata recentemente ampliata con nuove...
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Da Rohm un package per Mosfet SiC
TSC3PAK è la sigla di un nuovo package per Mosfet SiC sviluppato da Rohm....


