Components-en
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Infineon expands Prime Switch family
Infineon expands the high-power Prime Switch family with the new Press Pack IGBT (PPI)...
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u-blox announces a tri-radio module
u-blox has announced the u-blox MAYA-W2 tri-radio module. Supporting Wi-Fi 6, Bluetooth low energy...
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High efficiency low voltage 3A buck converter from Diodes Incorporated
Diodes Incorporated has introduced the automotive-compliant DIODES AP61300Q synchronous buck converters. These 3A-rated devices...
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M12 adapter from PROVERTHA with X to D and D to X coding
Provertha has developed a robust and extremely compact M12 adapter solution that allows a...
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Nexperia widens its offering of discrete components in DFN packaging with side-wettable flanks
Nexperia announced its latest product additions to a growing range of discrete devices which...
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Antenova’s new small dual-band antenna for IoT
Antenova launches a new low-profile antenna for Europe’s 868 MHz bands and the US...
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VIAVI releases ALT-9000 radio altimeter test solution
VIAVI Solutions announced the launch of the ALT-9000 universal radio altimeter (RADALT) flight line...
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Space-saving Schottky rectifiers from Diodes Incorporated
Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in...
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Magnachip introduces a new 40V MOSFET for BLDC motors
Magnachip Semiconductor announced that the company has released a new 40V Metal-Oxide-Semiconductor Field-Effect Transistor...
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Winbond and Infineon extend collaboration with double bandwidth HyperRAM 3.0
Winbond Electronics with Infineon Technologies have announced the expansion of their HYPERRAM product collaboration...
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VPC hybrid capacitors from VINATech replace batteries
VINATech has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used...
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Infineon extends CoolSiC M1H technology portfolio
Infineon Technologies introduces a new CoolSiC technology: the CoolSiC MOSFET 1200 V M1H. The...
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A new generation of 3D touchless user interfaces
TouchNetix announces fully integrated aXiom touchscreen chips which offer new 3D sensing capabilities by...
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Panasonic Industry’s new Solid Polymer capacitors
Panasonic Industry‘s SP-Cap (Solid Polymer ) portfolio of Aluminum Polymer capacitors is an interesting...
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The Capacitive Hidden Switch from Schurter now at Rutronik
The Capacitive Hidden Switch (CHS) from Schurter, available at Rutronik, functions entirely without mounting...
News/Analysis Tutti ▶
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Massimo Valerii è il nuovo presidente di Anie CSI
Anie CSI ha nominato presidente Massimo Valerii per il bienio 2026-2028. Anie CSI è l’associazione...
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Infineon e Siemens collaborano per proteggere i data center
Infineon e Siemens stanno collaborando per migliorare la protezione elettrica nei data center, impianti di...
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Cosmic Semiconductor Solutions a Pcim Europe 2026
Cosmic parteciperà per la prima volta a Pcim Europe 2026, evento che si terrà a...
Products Tutti ▶
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Murata: nuovi convertitori DC-DC ad alto isolamento
Murata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...
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TDK-Lambda introduce nuovi alimentatori per DIN rail
La gamma di prodotti TDK-Lambda della serie D1SE è stata recentemente ampliata con nuove...
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Da Rohm un package per Mosfet SiC
TSC3PAK è la sigla di un nuovo package per Mosfet SiC sviluppato da Rohm....


