EO_489

XXII Power POWER 23 - OTTOBRE 2020 Tabella 3 – Dissipazione di potenza stimata di MOSFET a doppio canale N per package Product category = dual N-channel MOSFET Package description Package type (drawing) Dimensions (mm) Typical R JA (°C/W) Estimated P DISS (W) LGA (L) PicoStar package (YME) 1.35 by 1.35 175 0.7 LGA (L) PicoStar package (YJE) 2.2 by 1.15 150 0.8 LGA (L) PicoStar package (YJG) 3.37 by 1.47 92.5 1.3 Wafer-level package (W1723) DSBGA (YZG) 1.7 by 2.3 140 0.9 2-mm-by-2-mm SON (Q2) WSON (DQK) 2.0 by 2.0 55 2.2 3-mm-by-3-mm SON (Q3E) VSON (DPA) 3.3 by 3.3 50 2.4 S0-8 (ND) SOIC (D) 5.0 by 6.0 60 2.0 Tabella 4 – Dissipazione di potenza stimata di MOSFET a singolo canale P per package Product category = single P-channel MOSFET Package description Package type (drawing) Dimensions (mm) Typical R JA (°C/W) Estimated P DISS (W) FemtoFET™ PicoStar package (YJM, YJN) 0.73 by 0.64 255 0.5 FemtoFET™ PicoStar package (YJC, YJJ) 1.0 by 0.6 245 0.5 FemtoFET™ PicoStar package (YJK) 1.53 by 0.77 245 0.5 LGA (L) PicoStar package (YMG) 1.2 by 1.2 225 0.5 Wafer-level package (W10) DSBGA (YZB) 1.0 by 1.0 275 0.4 Wafer-level package (W, W1015) DSBGA (YZC) 1.0 by 1.5 230 0.5 Wafer-level package (W, W15) DSBGA (YZF) 1.5 by 1.5 220 0.5 2-mm-by-2-mm SON (Q2) WSON (DQK) 2.0 by 2.0 55 2.2 Wirebond 3-mm-by-3-mm SON (Q3A) VSONP (DNH) 3.3 by 3.3 48 2.5 Clip 3-mm-by-3-mm SON (Q3) VSON-CLIP (DQG) 3.3 by 3.3 48 2.5 Tabella 5 – Dissipazione di potenza stimata di MOSFET a doppio canale P per package Product category = dual P-channel MOSFET Package description Package type (drawing) Dimensions (mm) Typical R JA (°C/W) Estimated P DISS (W) Wafer-level package (W1015) DSBGA (YZC) 1.0 by 1.5 230 0.5 Wafer-level package (W15) DSBGA (YZF) 1.5 by 1.5 220 0.5