EMB_75

EMBEDEDD 75 ANALOG DEVICES .................................................................................... I COPERTINA ASEM .......................................................................................................... 15 CONGATEC................................................................................................ 17 CONTRADATA ........................................................................................... IV COPERTINA DIGI-KEY ELECTRONICS.......................................................................... II COPERTINA EUROTECH ................................................................................................ 3 MC TRONIC ................................................................................................ 29 MESSE FRANKFURT – SPS ..................................................................... 51 MICROCHIP TECHNOLOGY...................................................................... 4 SI PARLA DI... INSERZIONISTI ADVANTECH ......................................................................................................................................................................19-33 ALLEANTIA ...............................................................................................................................................................................19 AMD..........................................................................................................................................................................................33 ANALOG DEVICES ...........................................................................................................................................................8-61-62 ARDUINO..................................................................................................................................................................................38 ASROCK INDUSTRIAL ..............................................................................................................................................................33 ATLANTIK ELEKTRONIK ..........................................................................................................................................................30 AVNET SILICA...........................................................................................................................................................................62 BEAGLEBOARD.ORG FOUNDATION..........................................................................................................................................30 CADENCE DESIGN SYSTEMS ...................................................................................................................................................62 CODESYS GROUP.....................................................................................................................................................................30 CONGATEC.....................................................................................................................................................................33-61-63 DIGI-KEY ELECTRONICS ..........................................................................................................................................................63 DIGILENT..................................................................................................................................................................................30 DUAGON ..................................................................................................................................................................................33 ECLIPSE FOUNDATION .............................................................................................................................................................16 EEPD ........................................................................................................................................................................................33 ENGINEERING SOLUTIONS .....................................................................................................................................................30 EPSON .....................................................................................................................................................................................26 FARNELL ..................................................................................................................................................................................63 FOUNDRIES.IO ..........................................................................................................................................................................30 FUTURE MARKET INSIGHTS ....................................................................................................................................................58 IAR SYSTEMS...........................................................................................................................................................................30 ICP ...........................................................................................................................................................................................61 INFINEON TECHNOLOGIES.......................................................................................................................................................64 IPROD ......................................................................................................................................................................................19 JEDEC .......................................................................................................................................................................................42 KIOXIA .....................................................................................................................................................................................64 KONTRON ...........................................................................................................................................................................22-33 MEAN WELL .............................................................................................................................................................................46 MEN MIKRO ELEKTRONIK .......................................................................................................................................................33 MENTOR GRAPHICS.................................................................................................................................................................33 MICROCHIP .............................................................................................................................................................................38 MICROSOFT .............................................................................................................................................................................26 MICROTRONICS ENGINEERING ..............................................................................................................................................30 MIKROELEKTRONIKA ...............................................................................................................................................................38 MOUSER ELECTRONICS...........................................................................................................................................................64 NASA ........................................................................................................................................................................................52 NATIONAL INSTRUMENTS .......................................................................................................................................................30 ON SEMICONDUCTOR..............................................................................................................................................................48 PERCEPIO.................................................................................................................................................................................52 PERFORCE SOFTWARE ...........................................................................................................................................................30 QTECHNOLOGY ........................................................................................................................................................................33 RIGOL TECHNOLOGIES ............................................................................................................................................................65 ROHM SEMICONDUCTOR ........................................................................................................................................................65 RUTRONIK................................................................................................................................................................................66 S&T Technologies.....................................................................................................................................................................22 SAMSUNG ...............................................................................................................................................................................26 SCHLEISSHEIMER SOFT UND HARDWAREENTWICKLUNG ....................................................................................................30 SECO ........................................................................................................................................................................................66 SIEMENS ..................................................................................................................................................................................33 SMART MODULAR TECHNOLOGIES.........................................................................................................................................42 SONY ........................................................................................................................................................................................26 STRATACACHE..........................................................................................................................................................................33 TEXAS INSTRUMENTS .............................................................................................................................................................66 TTI EUROPE..............................................................................................................................................................................46 WIBU-SYSTEMS .......................................................................................................................................................................22 WIND RIVER ............................................................................................................................................................................58 XILINX ......................................................................................................................................................................................30 EMBEDDED FEBBRAIO 6 Redazione Carlo Antonelli Direttore Responsabile Filippo Fossati Coordinamento Editoriale filippo.fossati@fieramilanomedia.it - tel: 02 49976506 Segreteria di Redazione - eo@fieramilanomedia.it Collaboratori: Rachel Beddor, Giorgio Fusari, Sergio Insalaco, Johan Kraft, Arturo Lotito, Pavan Mulabagal, Peter Müller, Alessandro Nobile, Anton Patyuchenko, Chris Perkins, Arthur Sainio Pubblicità Giuseppe De Gasperis Sales Manager giuseppe.degasperis@fieramilanomedia.it tel: 02 49976527 - fax: 02 49976570-1 Nadia Zappa Ufficio Traffico nadia.zappa@fieramilanomedia.it - tel: 02 49976534 International Sales U.K. – SCANDINAVIA – NETHERLAND – BELGIUM Huson European Media Tel +44 1932 564999 - Fax +44 1932 564998 Website: www.husonmedia.com USA - Huson International Media Tel +1 408 8796666 - Fax +1 408 8796669 Website: www.husonmedia.com TAIWAN - Worldwide Service co. Ltd Tel +886 4 23251784 - Fax +886 4 23252967 Website: www.acw.com.tw Grafica e fotolito Emmegi Group – Milano Aderente a: Proprietario ed Editore Fiera Milano Media Enio Gualandris Carlo Antonelli Sede legale Sede operativa ed amministrativa S S. del Sempione, 28 - 20017 Rho (MI) tel. +39 02 4997.1 fax +39 02 49976573 - www.tech-plus.it Fiera Milano Media è iscritta al Registro Operatori della Comunicazione n° 11125 del 25/07/2003. Tutti i diritti di riproduzione degli articoli pubblicati sono riservati. Manoscritti, disegni e fotografie non si restituiscono. www.elettronica-plus.it www.tech-plus.it www.fieramilanomedia.it SOCIETÀ PAG.

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