EMB_70

EMBEDEDD 70 CONGATEC................................................................................................ I COPERTINA DIGI-KEY ELECTRONICS.......................................................................... II COPERTINA EUROLINK SYSTEMS................................................................................ 41 EUROTECH ................................................................................................ 3 GOMA ELETTRONICA............................................................................... 33 KEVIN SCHURTER..................................................................................... 47 KONTRON .................................................................................................. 17 MC TRONIC ................................................................................................ 37 MESSE FRANKFURT – SPS 2019 ............................................................ III COPERTINA MESSE NURNBERG .................................................................................. 39 MICROCHIP TECHNOLOGY...................................................................... 29 MOUSER ELECTRONICS.......................................................................... IV COPERTINA MOXA ......................................................................................................... 4 TECNOLOGIX............................................................................................. INSERTO UNIVERSAL ROBOTS ............................................................................... 21 SI PARLA DI... INSERZIONISTI 4D SYSTEMS............................................................................................................................................................................44 ADVANTECH..............................................................................................................................................................................62 AMPHENOL...............................................................................................................................................................................76 AMS TECHNOLOGIES ...............................................................................................................................................................16 ANALOG DEVICES ....................................................................................................................................................................77 ARBOR......................................................................................................................................................................................77 ARDUINO..................................................................................................................................................................................38 ARM..........................................................................................................................................................................................30 ARROW ELECTRONICS ............................................................................................................................................................54 BMW.........................................................................................................................................................................................66 BORLAND ................................................................................................................................................................................72 CINCOZE ...................................................................................................................................................................................20 COMSOL ...................................................................................................................................................................................78 CONGATEC............................................................................................................................................................................8-16 CONTRADATA ...........................................................................................................................................................................20 CUI............................................................................................................................................................................................78 EE101........................................................................................................................................................................................30 EMCOMO ..................................................................................................................................................................................58 FEDERAL TRADE ......................................................................................................................................................................34 FENWAY EMBEDDED SYSTEMS.........................................................................................................................................70-80 FRAUNHOFER IML....................................................................................................................................................................58 FUTURE ELECTRONICS ............................................................................................................................................................14 GREEN HILLS SOFTWARE........................................................................................................................................................79 HAMAMATSU PHOTONICS ......................................................................................................................................................42 HAMMOND MANUFACTURING.................................................................................................................................................76 HARWIN....................................................................................................................................................................................79 HCC EMBEDDED.................................................................................................................................................................70-80 HIROSE.....................................................................................................................................................................................26 HSBC ........................................................................................................................................................................................66 IBM ...........................................................................................................................................................................................72 IDC............................................................................................................................................................................................66 INTEL CORPORATION...............................................................................................................................................................80 INTLAND SOFTWARE ...............................................................................................................................................................66 JAMPEL ....................................................................................................................................................................................22 JAPAN AVIATION ELECTRONICS INDUSTRY............................................................................................................................26 JST............................................................................................................................................................................................26 KBV RESEARCH........................................................................................................................................................................66 KONTRON .................................................................................................................................................................................58 LAUTERBACH ...........................................................................................................................................................................30 MARKET RESEARCH FUTURE ..................................................................................................................................................26 MASSACHUSETTS INSTITUTE OF TECHNOLOGY ....................................................................................................................72 MAXIM INTEGRATED................................................................................................................................................................18 MICRO FOCUS..........................................................................................................................................................................72 MICROSOFT..............................................................................................................................................................................72 MIPI ALLIANCE.........................................................................................................................................................................15 MITWELL..................................................................................................................................................................................80 MOLEX......................................................................................................................................................................................26 MORGAN STANLEY ..................................................................................................................................................................22 MOXA........................................................................................................................................................................................22 MURATA ELETTRONICA......................................................................................................................................................79-81 NATIONAL CENTER FOR HEALTH STATISTICS.........................................................................................................................34 NXP SEMICONDUCTORS..........................................................................................................................................................38 OEC...........................................................................................................................................................................................72 OMRON ELECTRONIC COMPONENTS......................................................................................................................................77 ON SEMICONDUCTOR..............................................................................................................................................................34 OVUM .......................................................................................................................................................................................66 PANASONIC ELECTRIC WORKS ...............................................................................................................................................14 PERCEPIO.................................................................................................................................................................................30 PHOENIX CONTACT ..................................................................................................................................................................26 PILZ ..........................................................................................................................................................................................42 PLS PROGRAMMIERBARE LOGIK & SYSTEME .......................................................................................................................30 PORTWELL ...............................................................................................................................................................................80 RECOM POWER........................................................................................................................................................................80 ROHM SEMICONDUCTOR ........................................................................................................................................................81 SEGGER MICROCONTROLLER SYSTEMS................................................................................................................................30 SMK ELECTRONICS..................................................................................................................................................................26 STMICROELECTRONICS...........................................................................................................................................................38 TDK LAMBDA............................................................................................................................................................................81 TE CONNECTIVITY....................................................................................................................................................................26 TECHNAVIO.........................................................................................................................................................................26-72 TEKTRONIX...............................................................................................................................................................................15 TOSHIBA ELECTRONICS...........................................................................................................................................................48 TOUCHNETIX ............................................................................................................................................................................78 TRENZ ELECTRONIC.................................................................................................................................................................54 XILINX ......................................................................................................................................................................................76 YOLE DÉVELOPPEMENT...........................................................................................................................................................24 EMBEDDED NOVEMBRE 6 Redazione Carlo Antonelli Direttore Responsabile Filippo Fossati Coordinamento Editoriale filippo.fossati@fieramilanomedia.it - tel: 02 49976506 Segreteria di Redazione - eo@fieramilanomedia.it Collaboratori: Antonella Pellegrini, David Brook, Emanuele Dal Lago, Martin Danzer, Steven Dean, Armin Derpmanns, Paul Diepstraten, Giorgio Fusari, Aldo Garosi (disegni), Norbert Hauser, Silvano Iacobucci, Alessandro Nobile, Lucio Pellizzari, Helmut Plotz, Markku Riihonen Pubblicità Giuseppe De Gasperis Sales Manager giuseppe.degasperis@fieramilanomedia.it tel: 02 49976527 - fax: 02 49976570-1 Nadia Zappa Ufficio Traffico nadia.zappa@fieramilanomedia.it - tel: 02 49976534 International Sales U.K. – SCANDINAVIA – NETHERLAND – BELGIUM Huson European Media Tel +44 1932 564999 - Fax +44 1932 564998 Website: 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Ltd Tel +886 4 23251784 - Fax +886 4 23252967 Website: www.acw.com.tw Grafica e fotolito Emmegi Group – Milano Stampa FAENZA GROUP Aderente a: Proprietario ed Editore Fiera Milano Media Enio Gualandris Carlo Antonelli Sede legale ! "# Sede operativa ed amministrativa S S. del Sempione, 28 - 20017 Rho (MI) tel. +39 02 4997.1 fax +39 02 49976573 - www.tech-plus.it Fiera Milano Media è iscritta al Registro Operatori della Comunicazione n° 11125 del 25/07/2003. Autorizzazione alla pubblicazione del tribunale di Milano n° 129 del 7/03/1978. Tutti i diritti di riproduzione degli articoli pubblicati sono riservati. Manoscritti, disegni e fotografie non si restituiscono. Embedded è supplemento di Elettronica Oggi. www.elettronica-plus.it www.tech-plus.it www.fieramilanomedia.it SOCIETÀ PAG.